1,1,3,3-Tetramethyl-1,3-divinyldisilazane

97%

Reagent Code: #239860
label
Alias 1,3-divinyl-1,1,3,3-tetramethyldisilazane
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CAS Number 7691-02-3

science Other reagents with same CAS 7691-02-3

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 185.41 g/mol
Formula C₈H₁₉NSi₂
badge Registry Numbers
EC Number 231-701-1
MDL Number MFCD00042846
thermostat Physical Properties
Boiling Point 161-163 °C
inventory_2 Storage & Handling
Density 0.819
Storage 2~8°C

description Product Description

Used as a key precursor in the synthesis of silicon-based polymers and coatings, particularly in the production of silicone resins with enhanced thermal and oxidative stability. Its vinyl and silazane functional groups enable cross-linking reactions, making it valuable in creating protective films and encapsulants for electronic devices. Also employed in vapor deposition processes to form silicon nitride-like thin films, which serve as dielectric layers or diffusion barriers in semiconductor manufacturing. The compound’s reactivity supports its use in modifying surfaces for improved adhesion and moisture resistance in advanced materials.

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Size Availability Unit Price Quantity
inventory 5ml
10-20 days ฿390.00
inventory 25ml
10-20 days ฿790.00
inventory 100ml
10-20 days ฿2,350.00
inventory 500ml
10-20 days ฿11,720.00

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1,1,3,3-Tetramethyl-1,3-divinyldisilazane
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Used as a key precursor in the synthesis of silicon-based polymers and coatings, particularly in the production of silicone resins with enhanced thermal and oxidative stability. Its vinyl and silazane functional groups enable cross-linking reactions, making it valuable in creating protective films and encapsulants for electronic devices. Also employed in vapor deposition processes to form silicon nitride-like thin films, which serve as dielectric layers or diffusion barriers in semiconductor manufacturin

Used as a key precursor in the synthesis of silicon-based polymers and coatings, particularly in the production of silicone resins with enhanced thermal and oxidative stability. Its vinyl and silazane functional groups enable cross-linking reactions, making it valuable in creating protective films and encapsulants for electronic devices. Also employed in vapor deposition processes to form silicon nitride-like thin films, which serve as dielectric layers or diffusion barriers in semiconductor manufacturing. The compound’s reactivity supports its use in modifying surfaces for improved adhesion and moisture resistance in advanced materials.

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