Used as a high-performance polyimide precursor in advanced aerospace and electronics applications due to its exceptional thermal stability and mechanical strength at elevated temperatures. Commonly employed in the production of heat-resistant coatings, flexible printed circuits, and insulating films for microelectronics. Its low dielectric constant and good solubility in organic solvents make it suitable for thin-film processing in semiconductor manufacturing. Also utilized in gas separation membranes owing to its rigid aromatic structure and selective permeability.