1-[[2-(Dimethylamino)ethyl]amino]-9H-thioxanthen-9-one

≥95%

Reagent Code: #167865
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CAS Number 19058-08-3

science Other reagents with same CAS 19058-08-3

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 298.4026 g/mol
Formula C₁₇H₁₈N₂OS
thermostat Physical Properties
Boiling Point 486.2±45.0 °C(Predicted)
inventory_2 Storage & Handling
Density 1.252±0.06 g/cm3(Predicted)
Storage 2-8°C

description Product Description

Used primarily in photopolymerization processes as a photoinitiator, enabling rapid curing of coatings, inks, and adhesives under UV or visible light. It is especially effective in dental composites and 3D printing resins due to its high sensitivity and efficiency in initiating free radical reactions. Its ability to absorb light in the near-UV to visible range makes it suitable for applications requiring low-energy light sources. Also employed in holographic recording materials and photoresists for microelectronics fabrication.

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 250mg
10-20 days ฿80,000.00
inventory 500mg
10-20 days ฿136,000.00
inventory 100mg
10-20 days ฿40,000.00

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1-[[2-(Dimethylamino)ethyl]amino]-9H-thioxanthen-9-one
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Used primarily in photopolymerization processes as a photoinitiator, enabling rapid curing of coatings, inks, and adhesives under UV or visible light. It is especially effective in dental composites and 3D printing resins due to its high sensitivity and efficiency in initiating free radical reactions. Its ability to absorb light in the near-UV to visible range makes it suitable for applications requiring low-energy light sources. Also employed in holographic recording materials and photoresists for micro

Used primarily in photopolymerization processes as a photoinitiator, enabling rapid curing of coatings, inks, and adhesives under UV or visible light. It is especially effective in dental composites and 3D printing resins due to its high sensitivity and efficiency in initiating free radical reactions. Its ability to absorb light in the near-UV to visible range makes it suitable for applications requiring low-energy light sources. Also employed in holographic recording materials and photoresists for microelectronics fabrication.

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