(2-Methylphenyl)(2,4,6-trimethylphenyl)iodonium Trifluoromethanesulfonate

≥98%

Reagent Code: #78328
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CAS Number 210823-54-4

science Other reagents with same CAS 210823-54-4

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 486.29 g/mol
Formula C₁₇H₁₈F₃IO₃S
badge Registry Numbers
MDL Number MFCD20264884
thermostat Physical Properties
Melting Point 166-170°C
inventory_2 Storage & Handling
Storage room temperature

description Product Description

This chemical is widely used in photolithography processes, particularly in the semiconductor industry, where it serves as a photoacid generator (PAG). When exposed to ultraviolet (UV) light, it releases strong acids that catalyze the cross-linking or decomposition of photoresists, enabling precise patterning on silicon wafers. Its high thermal stability and efficient acid generation make it suitable for advanced lithography techniques, including deep UV (DUV) and extreme UV (EUV) lithography. Additionally, it is employed in the synthesis of specialty chemicals and polymers, where its ability to initiate cationic polymerization is leveraged to produce high-performance materials. Its applications also extend to advanced coatings and adhesives, where it enhances curing efficiency and material properties.

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Test Parameter Specification
Appearance White - Pale reddish yellow Crystal - Powder
Purity 98-100
Infrared Spectrum Conforms to Structure

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 1g
10-20 days ฿4,010.00
inventory 200mg
10-20 days ฿1,100.00

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(2-Methylphenyl)(2,4,6-trimethylphenyl)iodonium Trifluoromethanesulfonate
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This chemical is widely used in photolithography processes, particularly in the semiconductor industry, where it serves as a photoacid generator (PAG). When exposed to ultraviolet (UV) light, it releases strong acids that catalyze the cross-linking or decomposition of photoresists, enabling precise patterning on silicon wafers. Its high thermal stability and efficient acid generation make it suitable for advanced lithography techniques, including deep UV (DUV) and extreme UV (EUV) lithography. Additional

This chemical is widely used in photolithography processes, particularly in the semiconductor industry, where it serves as a photoacid generator (PAG). When exposed to ultraviolet (UV) light, it releases strong acids that catalyze the cross-linking or decomposition of photoresists, enabling precise patterning on silicon wafers. Its high thermal stability and efficient acid generation make it suitable for advanced lithography techniques, including deep UV (DUV) and extreme UV (EUV) lithography. Additionally, it is employed in the synthesis of specialty chemicals and polymers, where its ability to initiate cationic polymerization is leveraged to produce high-performance materials. Its applications also extend to advanced coatings and adhesives, where it enhances curing efficiency and material properties.

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