Used as a photoacid generator (PAG) in photoresist formulations for semiconductor manufacturing. Upon exposure to deep ultraviolet (DUV) light, it releases strong acid that catalyzes chemical changes in the resist, enabling precise pattern development during photolithography. Commonly applied in positive and negative tone resists for high-resolution imaging, especially in advanced node fabrication. Also utilized in some epoxy curing processes where light-triggered acid initiation is required, offering controlled, on-demand polymerization without thermal input.