Used as a photoacid generator in advanced photoresist formulations for semiconductor manufacturing, particularly in deep ultraviolet (DUV) lithography. Upon exposure to light, it releases strong acids that catalyze chemical transformations in the resist, enabling precise pattern development. Also employed in cationic polymerization reactions, where it acts as an efficient initiator under light exposure, useful in coatings, inks, and specialty polymers. Its thermal stability and controlled reactivity make it suitable for applications requiring high precision and minimal premature activation.