Used as a photoacid generator in advanced photoresist formulations for semiconductor lithography. Upon exposure to ultraviolet or deep ultraviolet light, it releases strong acid (triflic acid), which catalyzes chemical transformations in the resist film, enabling precise pattern development. Also employed in cationic polymerization reactions, where it initiates the curing of epoxy and vinyl ether monomers under light exposure, useful in coatings, inks, and adhesives. Its thermal stability and efficient acid generation make it suitable for applications requiring high resolution and controlled reactivity in microfabrication processes.