(2,2,6,6-Tetramethyl-3,5-heptanedionato)copper(II)
98%
Reagent
Code: #239938
Alias
Bis(2,2,6,6,-tetramethyl-3,5-heptanedionic acid) copper
CAS Number
14040-05-2
blur_circular Chemical Specifications
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Molecular Information
Weight
430.08 g/mol
Formula
C₂₂H₃₈CuO₄
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Registry Numbers
MDL Number
MFCD00058920
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Physical Properties
Melting Point
198 °C (dec.)(lit.)
Boiling Point
315 °C
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Storage & Handling
Storage
Room temperature, dry
description Product Description
Used as a precursor in chemical vapor deposition (CVD) processes to produce copper-containing thin films for semiconductor and electronic devices. Its volatility and thermal stability make it suitable for depositing high-purity copper oxide or copper metal layers at relatively low temperatures. Also employed in research for catalytic applications and as a source of copper in the synthesis of nanomaterials. Due to its well-defined structure and solubility in organic solvents, it is utilized in solution-based methods for fabricating functional coatings and advanced materials.
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