Used as a curing agent and accelerator in epoxy resin systems, particularly in electronic encapsulation and adhesives. It enables controlled, latent curing, meaning the reaction remains stable at room temperature and activates upon heating, which is ideal for one-component formulations. Commonly applied in semiconductor sealing, printed circuit boards, and electrical insulation due to its excellent thermal stability and low viscosity processing. Also utilized in coatings and composites requiring long shelf life and high reliability.