Hexamethyl disilylamine (HMDS) is widely used in the semiconductor industry as a priming agent for photoresist adhesion. It is applied to silicon wafers to create a hydrophobic surface, which improves the uniformity and adhesion of photoresists during lithography processes. This ensures precise patterning in microchip manufacturing. HMDS is also utilized in organic synthesis as a silylating agent, protecting reactive functional groups like hydroxyl and amine during chemical reactions. Additionally, it serves as a precursor in the production of silicon-based materials, including silicon nitride and silicon carbide, which are essential in advanced ceramics and electronics. Its volatility and reactivity make it a valuable chemical in both industrial and laboratory settings.