1,3-Dimethoxy-1,1,3,3-Tetramethyl Disiloxane

97%

Reagent Code: #88102
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CAS Number 18187-24-1

science Other reagents with same CAS 18187-24-1

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 194.377 g/mol
Formula C₆H₁₈O₃Si₂
badge Registry Numbers
MDL Number MFCD01861727
inventory_2 Storage & Handling
Storage 2~8℃,Seal

description Product Description

Used as a key intermediate in the synthesis of silicone polymers, it contributes to the production of materials with desirable properties like flexibility, thermal stability, and water repellency.

Applied in the formulation of coatings and sealants, it enhances durability and resistance to environmental factors such as moisture and UV radiation.

In the electronics industry, it serves as a precursor for dielectric materials, aiding in the development of insulating layers for semiconductors and other components.

Also utilized in the creation of release agents for molding processes, ensuring smooth demolding and extending the lifespan of molds.

Its role in surface modification improves the performance of various substrates, making them more suitable for specific industrial applications.

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Test Parameter Specification
Appearance White solid
Purity 96.5-100%
Infrared Spectrum Conforms to Structure

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Size Availability Unit Price Quantity
inventory 1ml
10-20 days ฿860.00
inventory 5ml
10-20 days ฿2,280.00
inventory 25ml
10-20 days ฿13,600.00

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1,3-Dimethoxy-1,1,3,3-Tetramethyl Disiloxane
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Used as a key intermediate in the synthesis of silicone polymers, it contributes to the production of materials with desirable properties like flexibility, thermal stability, and water repellency.

Applied in the formulation of coatings and sealants, it enhances durability and resistance to environmental factors such as moisture and UV radiation.

In the electronics industry, it serves as a precursor for dielectric materials, aiding in the development of insulating layers for semiconductors and

Used as a key intermediate in the synthesis of silicone polymers, it contributes to the production of materials with desirable properties like flexibility, thermal stability, and water repellency.

Applied in the formulation of coatings and sealants, it enhances durability and resistance to environmental factors such as moisture and UV radiation.

In the electronics industry, it serves as a precursor for dielectric materials, aiding in the development of insulating layers for semiconductors and other components.

Also utilized in the creation of release agents for molding processes, ensuring smooth demolding and extending the lifespan of molds.

Its role in surface modification improves the performance of various substrates, making them more suitable for specific industrial applications.

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