Poly(dimethylsiloxane-co-methylhydrosiloxane), trimethylsilyl terminated

average Mn ~13,000, methylhydrosiloxane 3-4 mol %

Reagent Code: #223635
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CAS Number 68037-59-2

science Other reagents with same CAS 68037-59-2

blur_circular Chemical Specifications

badge Registry Numbers
MDL Number MFCD01325013
thermostat Physical Properties
Boiling Point > 93 °C-lit.
inventory_2 Storage & Handling
Storage Room temperature, sealed

description Product Description

Used as a crosslinker in silicone curing systems, especially in addition-cure silicones. Provides improved thermal stability and flexibility in cured elastomers. Commonly applied in mold making, encapsulation, and sealants where low shrinkage and excellent release properties are required. Also utilized in coatings and release agents due to its surface compatibility and ability to migrate to interfaces. Suitable for use in medical devices and electronics due to low toxicity and good electrical insulation after curing.

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Size Availability Unit Price Quantity
inventory 25ml
10-20 days ฿8,560.00
inventory 100ml
10-20 days ฿29,960.00

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Poly(dimethylsiloxane-co-methylhydrosiloxane), trimethylsilyl terminated
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Used as a crosslinker in silicone curing systems, especially in addition-cure silicones. Provides improved thermal stability and flexibility in cured elastomers. Commonly applied in mold making, encapsulation, and sealants where low shrinkage and excellent release properties are required. Also utilized in coatings and release agents due to its surface compatibility and ability to migrate to interfaces. Suitable for use in medical devices and electronics due to low toxicity and good electrical insulation

Used as a crosslinker in silicone curing systems, especially in addition-cure silicones. Provides improved thermal stability and flexibility in cured elastomers. Commonly applied in mold making, encapsulation, and sealants where low shrinkage and excellent release properties are required. Also utilized in coatings and release agents due to its surface compatibility and ability to migrate to interfaces. Suitable for use in medical devices and electronics due to low toxicity and good electrical insulation after curing.

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