Used as a coupling agent in hybrid organic-inorganic materials, enhancing adhesion between organic polymers and inorganic surfaces such as glass, metals, and fillers. Commonly applied in UV-curable coatings, adhesives, and composite resins where it improves mechanical strength, thermal stability, and moisture resistance. Frequently employed in sol-gel processes to incorporate organic functionality into silica-based networks. Also utilized in dental composites and electronic encapsulants due to its ability to form stable epoxy-silane networks.