Used as a coupling agent in the production of composites, enhancing adhesion between organic polymers and inorganic materials. It is applied in coatings to improve durability and resistance to environmental factors. In the electronics industry, it serves as a surface modifier for semiconductors, ensuring better performance and reliability. Additionally, it is utilized in the formulation of adhesives and sealants, providing enhanced bonding strength and flexibility. Its epoxy functional group allows for cross-linking in various polymer systems, making it valuable in the development of advanced materials.