This chemical is widely used as a coupling agent in the field of materials science, particularly for modifying surfaces to enhance adhesion between organic and inorganic materials. It is commonly applied in the production of composites, coatings, and adhesives, where it improves the bonding strength and durability of the final product. In the electronics industry, it is utilized to functionalize surfaces of semiconductors, glass, or metals, enabling better integration with polymers or other organic compounds. Additionally, it plays a role in the development of advanced nanomaterials, such as nanoparticles and thin films, by facilitating controlled surface modifications. Its ability to form stable bonds with both silica-based substrates and organic molecules makes it valuable in creating hybrid materials for various industrial applications.