This chemical is widely used as a coupling agent in the formulation of adhesives, sealants, and coatings. It enhances the adhesion between organic polymers and inorganic substrates, such as glass, metals, and ceramics, by forming strong chemical bonds. In the electronics industry, it is applied as a surface modifier to improve the performance of epoxy resins in printed circuit boards and encapsulants. Additionally, it is utilized in the production of fiberglass composites to increase the mechanical strength and durability of the final product. Its ability to improve water resistance and thermal stability makes it valuable in various industrial applications.