Used in electroplating processes, particularly for tin and tin-lead alloys as well as aluminum, due to its ability to provide stable electrolyte solutions with good conductivity and uniform metal deposition. Commonly employed in the manufacturing of electronic components and printed circuit boards where consistent plating thickness is critical. Also used as a flux in soldering and welding, especially for non-ferrous metals like aluminum, to reduce melting points and prevent oxidation. Serves as a catalyst in some organic synthesis reactions, especially in alkylation and acylation processes. Used in the production of boron trifluoride by thermal decomposition. Occasionally applied in metal surface treatment to improve adhesion and corrosion resistance prior to coating or painting. Additionally, utilized as a fluoride source in various chemical reactions and laboratory research, and in the ceramics and glass industries to enhance properties such as strength and heat resistance.