Used primarily as a reactive diluent in UV-curable coatings and inks, it enhances the flexibility and adhesion of the final product. Its application extends to the production of high-performance adhesives, where it improves curing speed and durability. Additionally, it is employed in the formulation of advanced composites, contributing to better mechanical properties and resistance to environmental factors. In electronics, it serves as a key component in encapsulating materials, providing excellent insulation and protection for sensitive components.