Used as a reactive diluent and crosslinking agent in epoxy resin systems, enhancing flexibility and adhesion in coatings, adhesives, and composite materials. Its unique bridged bicyclic structure contributes to improved thermal and mechanical properties in cured resins. Commonly applied in high-performance industrial coatings, electronic encapsulants, and aerospace composites where durability and chemical resistance are critical. Also utilized in specialty polymers for 3D printing resins due to its ability to reduce viscosity while maintaining reactivity.