Used primarily as a reactive diluent in epoxy resin systems, improving processability, reducing viscosity, and enhancing flexibility and impact resistance without significantly compromising other mechanical or thermal properties of the cured resin. Its low volatility makes it suitable for applications requiring reduced emissions, such as in coatings, adhesives, and electrical encapsulants. Commonly employed in composite materials and fiber-reinforced plastics where enhanced resin flow and wetting are needed. Also utilized in formulations for electronic components due to its good electrical insulation properties and adhesion to various substrates.