Used as a reactive diluent and crosslinking agent in epoxy resin systems, enhancing flexibility and reducing viscosity without compromising thermal stability. Commonly applied in electronic encapsulation, adhesives, and coatings where low shrinkage and high chemical resistance are required. Its spirocyclic structure contributes to low dielectric constant, making it suitable for advanced printed circuit board materials. Also utilized in UV-curable formulations due to its ability to improve curing efficiency and mechanical properties.