Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance, enabling easier processing and improved wetting of substrates. Commonly applied in coatings, adhesives, and composite materials where enhanced flexibility and adhesion are required. Also utilized in the synthesis of specialty polymers and as an intermediate in the production of pharmaceuticals and surfactants. Its ability to participate in ring-opening reactions makes it valuable in modifying resin properties for industrial and electronic applications.