Used as a reactive nanofiller in high-performance polymers, enhancing thermal stability, mechanical strength, and flame resistance. Commonly applied in aerospace composites, electronic encapsulants, and advanced coatings where lightweight and durability are critical. Its epoxy functionality allows it to participate in curing reactions, improving crosslink density without sacrificing processability. Also utilized in UV-curable resins for optical materials and 3D printing, offering reduced shrinkage and increased hardness.