Used primarily in the synthesis of high-performance polyimides, this compound contributes to the development of thermally stable and mechanically strong polymers. These polyimides are essential in aerospace, electronics, and microchip manufacturing due to their ability to withstand extreme temperatures and harsh environments. The rigid cyclic structure enhances the glass transition temperature and reduces thermal expansion, making the resulting materials suitable for use in flexible printed circuits, insulating coatings, and composite matrices. Additionally, it finds application in gas separation membranes where molecular rigidity improves selectivity and permeability.