Used as a key intermediate in the synthesis of high-performance polyimides, particularly for applications requiring excellent thermal stability and mechanical strength. Commonly employed in the production of advanced materials for aerospace, electronics, and semiconductor industries due to its ability to form rigid, thermally resistant polymer structures. Its trifluoromethyl groups enhance solubility in organic solvents and improve dielectric properties, making it suitable for use in electronic encapsulation and insulating films. Also utilized in specialty coatings where resistance to heat, chemicals, and oxidation is critical.