Used primarily in the synthesis of high-performance polyimides, this compound contributes to the development of thermally stable and mechanically strong polymers. These polyimides are essential in aerospace, electronics, and microchip manufacturing due to their ability to withstand extreme temperatures and harsh environments. The rigid molecular structure enhances the glass transition temperature and reduces thermal expansion, making it suitable for use in insulating coatings, printed circuit boards, and composite materials. Additionally, it is employed in specialty adhesives and films requiring dimensional stability and resistance to radiation and chemicals.