PEEK pure resin Fine powder
For molding
Reagent
Code: #223616
CAS Number
29658-26-2
blur_circular Chemical Specifications
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Molecular Information
Formula
[OC₆H₄OC₆H₄COC₆H₄]n
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Registry Numbers
MDL Number
MFCD00217725
thermostat
Physical Properties
Melting Point
322 °C
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Storage & Handling
Density
1.3 g/mL(25 °C)
Storage
Room temperature
description Product Description
Used in high-performance 3D printing for aerospace and medical implants due to its excellent thermal stability and mechanical strength. Commonly applied in manufacturing lightweight, durable components that withstand extreme environments. Widely used in spinal and trauma implants because of its biocompatibility and radiolucency. Employed in automotive and oil & gas industries for seals, bearings, and pump parts exposed to high temperatures and corrosive chemicals. Suitable for semiconductor manufacturing equipment due to low particle emission and high chemical resistance.
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