PEEK
Low-flow powder, melt index ≤6
Reagent
Code: #222564
Alias
Poly(oxo-1,4-phenyleneoxy-1,4-phenylenecarbonyl-1,4-phenylene)
CAS Number
29658-26-2
blur_circular Chemical Specifications
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Molecular Information
Formula
[OC₆H₄OC₆H₄COC₆H₄]n
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Registry Numbers
MDL Number
MFCD00217725
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Physical Properties
Melting Point
322°C
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Storage & Handling
Density
1.3±0.05 g/cm3
Storage
Room temperature
description Product Description
Used in aerospace and automotive industries for lightweight, high-strength components due to excellent mechanical and thermal stability. Commonly found in seals, bearings, and compressor parts that must withstand high temperatures and harsh chemicals. Widely adopted in medical implants, such as spinal devices, because it is biocompatible and radiolucent, allowing clear imaging. Employed in oil and gas equipment for its resistance to corrosion and high-pressure environments. Also used in semiconductor manufacturing and electrical insulation where purity and performance under heat are critical.
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