PEEK
High fluidity particles, melt index ≥15
Reagent
Code: #222563
Alias
Poly(oxo-1,4-phenyleneoxy-1,4-phenylenecarbonyl-1,4-phenylene)
CAS Number
29658-26-2
blur_circular Chemical Specifications
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Molecular Information
Formula
[OC₆H₄OC₆H₄COC₆H₄]n
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Registry Numbers
MDL Number
MFCD00217725
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Physical Properties
Melting Point
322°C
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Storage & Handling
Density
1.3±0.05 g/cm
Storage
Room temperature
description Product Description
Used in aerospace and automotive industries for lightweight, high-strength components due to excellent thermal stability and resistance to chemicals. Common in seals, bearings, and compressor parts. Widely adopted in medical implants like spinal devices because it is biocompatible and radiolucent. Employed in semiconductor manufacturing for wafer carriers and handling equipment thanks to low particle generation and high purity. Also used in oil and gas applications for downhole tools and seals exposed to harsh environments. Increasingly used in 3D printing for functional prototypes and end-use parts requiring durability.
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