PEEK

High fluidity particles, melt index ≥15

Reagent Code: #222563
label
Alias Poly(oxo-1,4-phenyleneoxy-1,4-phenylenecarbonyl-1,4-phenylene)
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CAS Number 29658-26-2

blur_circular Chemical Specifications

scatter_plot Molecular Information
Formula [OC₆H₄OC₆H₄COC₆H₄]n
badge Registry Numbers
MDL Number MFCD00217725
thermostat Physical Properties
Melting Point 322°C
inventory_2 Storage & Handling
Density 1.3±0.05 g/cm
Storage Room temperature

description Product Description

Used in aerospace and automotive industries for lightweight, high-strength components due to excellent thermal stability and resistance to chemicals. Common in seals, bearings, and compressor parts. Widely adopted in medical implants like spinal devices because it is biocompatible and radiolucent. Employed in semiconductor manufacturing for wafer carriers and handling equipment thanks to low particle generation and high purity. Also used in oil and gas applications for downhole tools and seals exposed to harsh environments. Increasingly used in 3D printing for functional prototypes and end-use parts requiring durability.

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 25g
10-20 days ฿2,190.00
inventory 100g
10-20 days ฿5,790.00

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