Used as a high-performance monomer in the synthesis of specialty polyamides and polyimides, particularly for applications requiring exceptional thermal stability and chemical resistance. Its unique fluorinated aromatic structure enhances solubility in polar aprotic solvents and contributes to low dielectric constants, making it valuable in advanced electronic materials such as flexible printed circuit boards and semiconductor encapsulation. The presence of amide and hydroxyl groups allows for hydrogen bonding and further chemical modification, improving adhesion and mechanical strength in composite materials. Commonly employed in aerospace, microelectronics, and optoelectronic devices where durability under extreme conditions is critical.