Used primarily in electroplating processes to deposit thin, uniform layers of platinum on various substrates. It serves as a source of platinum in specialty plating baths, especially where controlled release of metal ions and good adhesion of the plated layer are required. The presence of ethylene ligands helps stabilize the complex in solution, improving plating efficiency and surface finish. Commonly applied in the electronics industry for manufacturing contacts, connectors, and electrodes requiring high corrosion resistance and electrical conductivity. Also utilized in research settings for synthesizing platinum-based catalysts or model compounds in organometallic chemistry.