Used as a key intermediate in the synthesis of high-performance polymers, particularly in the production of polyimides. These polymers exhibit excellent thermal stability, mechanical strength, and electrical insulation properties, making them suitable for aerospace, electronics, and microchip manufacturing applications. The compound’s rigid structure contributes to enhancing the glass transition temperature and overall durability of the resulting materials. It is also employed in specialty resins for coatings and adhesives requiring resistance to extreme environments.