Used as a highly efficient photoinitiator in advanced photoresist systems for semiconductor manufacturing. Enables high-resolution patterning in deep ultraviolet (DUV) lithography due to its strong absorption at 193 nm and excellent thermal stability. Facilitates the production of fine circuit patterns in microelectronics by generating reactive species upon light exposure, initiating crosslinking or decomposition of the resist matrix. Also employed in specialty coatings and advanced 3D printing applications requiring precise feature control and low outgassing.