1,3-Dioxoisoindolin-2-yl 2-methyl-2-phenylpropanoate

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Reagent Code: #179566
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CAS Number 2241846-03-5

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blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 309.321 g/mol
Formula C₁₈H₁₅NO₄
inventory_2 Storage & Handling
Storage 2-8°C, Inert Gas

description Product Description

Used as a photoinitiator in UV-curable systems, enabling rapid polymerization of inks, coatings, and adhesives upon exposure to ultraviolet light. Its ability to generate free radicals under UV irradiation makes it effective in clear and pigmented formulations, including printing inks and electronic materials. Exhibits good solubility in monomers and oligomers, supporting stable performance in various resin systems. Suitable for applications requiring low yellowing and high reactivity, especially in thin-film curing processes.

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Size Availability Unit Price Quantity
inventory 250mg
10-20 days ฿1,740.00
inventory 1g
10-20 days ฿4,740.00
inventory 5g
10-20 days ฿19,140.00

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1,3-Dioxoisoindolin-2-yl 2-methyl-2-phenylpropanoate
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Used as a photoinitiator in UV-curable systems, enabling rapid polymerization of inks, coatings, and adhesives upon exposure to ultraviolet light. Its ability to generate free radicals under UV irradiation makes it effective in clear and pigmented formulations, including printing inks and electronic materials. Exhibits good solubility in monomers and oligomers, supporting stable performance in various resin systems. Suitable for applications requiring low yellowing and high reactivity, especially in thin

Used as a photoinitiator in UV-curable systems, enabling rapid polymerization of inks, coatings, and adhesives upon exposure to ultraviolet light. Its ability to generate free radicals under UV irradiation makes it effective in clear and pigmented formulations, including printing inks and electronic materials. Exhibits good solubility in monomers and oligomers, supporting stable performance in various resin systems. Suitable for applications requiring low yellowing and high reactivity, especially in thin-film curing processes.

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