n-Hexylphosphonic acid
98%
Reagent
Code: #194528
CAS Number
4721-24-8
blur_circular Chemical Specifications
scatter_plot
Molecular Information
Weight
166.16 g/mol
Formula
C₆H₁₃P(O)(OH)₂
badge
Registry Numbers
MDL Number
MFCD00013961
thermostat
Physical Properties
Melting Point
108-110°C
Boiling Point
299.7ºC at 760 mmHg
inventory_2
Storage & Handling
Density
1.132
Storage
Room temperature, seal, dry
description Product Description
Used as a surface modifier in semiconductor and electronic materials processing, particularly in the fabrication of organic thin-film transistors (OTFTs). It helps improve interface properties by forming self-assembled monolayers on metal oxides, enhancing device performance through reduced interfacial defects and better charge transport. Also employed in corrosion inhibition and as a ligand in nanoparticle synthesis due to its strong binding affinity to metal surfaces. Its hydrophobic nature contributes to moisture resistance in coatings and protective films.
shopping_cart Available Sizes & Pricing
Cart
No products
Subtotal:
0.00
Total
0.00
THB