n-Hexylphosphonic acid

98%

Reagent Code: #194528
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CAS Number 4721-24-8

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 166.16 g/mol
Formula C₆H₁₃P(O)(OH)₂
badge Registry Numbers
MDL Number MFCD00013961
thermostat Physical Properties
Melting Point 108-110°C
Boiling Point 299.7ºC at 760 mmHg
inventory_2 Storage & Handling
Density 1.132
Storage Room temperature, seal, dry

description Product Description

Used as a surface modifier in semiconductor and electronic materials processing, particularly in the fabrication of organic thin-film transistors (OTFTs). It helps improve interface properties by forming self-assembled monolayers on metal oxides, enhancing device performance through reduced interfacial defects and better charge transport. Also employed in corrosion inhibition and as a ligand in nanoparticle synthesis due to its strong binding affinity to metal surfaces. Its hydrophobic nature contributes to moisture resistance in coatings and protective films.

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 1g
10-20 days ฿300.00
inventory 5g
10-20 days ฿450.00
inventory 100g
10-20 days ฿4,590.00
inventory 500g
10-20 days ฿22,000.00
inventory 25g
10-20 days ฿1,530.00

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