Widely used as a reactive flame retardant in epoxy resins and other polymer systems. It participates directly in the polymerization process, becoming chemically bonded into the polymer matrix, which enhances flame resistance without leaching. Commonly applied in printed circuit boards, electronic encapsulants, and high-performance composites where thermal stability and flame retardancy are critical. Its structure contributes to char formation during combustion, reducing flammability and smoke generation. Also utilized in coatings and adhesives requiring improved fire safety.