Widely used as a reactive flame retardant in epoxy resins and polyurethanes, particularly in printed circuit boards and electronic encapsulation materials. Its structure allows it to participate in polymerization, becoming chemically bonded into the resin matrix, which enhances flame resistance without leaching. Offers good thermal stability and maintains mechanical properties of the base polymer. Also applied in high-performance composites where long-term durability and fire safety are critical. Shows effectiveness in reducing both flammability and smoke generation in combustion.