Copper superfine powder
99.9% metals basis, -300 mesh, nearly spherical
blur_circular Chemical Specifications
description Product Description
Copper superfine powder is widely used in electronics and conductive materials due to its excellent electrical conductivity. It serves as a key component in the production of conductive inks, pastes, and coatings used in printed circuit boards, flexible electronics, touch screen panels, and semiconductor devices. Its high surface area enhances sintering at lower temperatures, making it ideal for low-temperature manufacturing processes. It is also popular in solar cell production for efficient electrodes, helping reduce costs compared to using silver.
In additive manufacturing and 3D printing, copper superfine powder is used to fabricate complex metal parts with high thermal and electrical performance.
It is employed in surface coating industries to enhance corrosion resistance and improve thermal conductivity in machine parts.
It is also employed in catalyst applications, especially in chemical synthesis, organic reactions, and environmental remediation such as processing waste gases into safe substances, where its reactivity improves process efficiency.
Additionally, it finds use in antimicrobial coatings for medical devices and surfaces, leveraging copper’s natural biocidal properties. The fine particle size allows for uniform dispersion in polymers and composites, improving thermal conductivity and mechanical strength in advanced materials.
format_list_bulleted Product Specification
| Test Parameter | Specification |
|---|---|
| Appearance | solid |
| Purity (%) | 99.9-100% |
| Particle Size | >= 300 mesh |
| Infrared Spectrum | Conforms to Structure |
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