Copper nanoparticles (60-100 nm, 99.9% metals basis, black powder) exhibit enhanced properties compared to bulk copper, making them suitable for advanced applications. Due to their high surface area and reactivity, they are used as catalysts in organic synthesis, such as in Ullmann coupling reactions and hydrogenation processes. In electronics, nano copper serves as a conductive additive in inks, pastes, and flexible circuits, enabling printed electronics and EMI shielding. Their antimicrobial efficacy is leveraged in coatings for medical devices, textiles, and touch surfaces to inhibit bacterial growth. Additionally, they improve thermal conductivity in composites for heat sinks and act as friction reducers in lubricants and nanofluids for industrial machinery.