Copper foil
99.9% metals basis, width: 13 mm, thickness: 0.3 mm
Reagent
Code: #159917
CAS Number
7440-50-8
blur_circular Chemical Specifications
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Molecular Information
Weight
63.55 g/mol
Formula
Cu
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Registry Numbers
EC Number
231-159-6
MDL Number
MFCD00010965
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Physical Properties
Melting Point
1083.4 °C(lit.)
Boiling Point
2580 °C
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Storage & Handling
Density
8.94 g/mL at 25 °C(lit.)
Storage
Room temperature
description Product Description
Copper foil is widely used in the electronics industry, especially in printed circuit boards (PCBs), where it serves as the conductive layer that carries electrical signals between components. Its high electrical and thermal conductivity make it ideal for efficient power transmission and heat dissipation. In flexible electronics, thin copper foil is laminated onto polymer substrates to create bendable circuits used in smartphones, wearable devices, and foldable displays. It is also a key component in lithium-ion batteries, where it acts as the anode current collector due to its stability and low resistance. Additionally, copper foil is used in electromagnetic shielding to protect sensitive electronic equipment from interference. Its malleability and durability support use in high-frequency communication devices and advanced semiconductor packaging.
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