Used in electroplating processes to deposit thin layers of lead onto metal surfaces for corrosion resistance and solderability. Commonly applied in the electronics industry for coating components and connectors. Also utilized in research laboratories for calibration of analytical instruments such as atomic absorption spectrometers and ICP-MS. Serves as a precursor in the synthesis of lead-based materials and in environmental testing to assess lead detection methods. Requires careful handling due to toxicity and environmental hazards.