Used as a curing agent and accelerator in epoxy resin systems, particularly in adhesives, coatings, and electronic encapsulants. It promotes rapid polymerization at elevated temperatures, offering excellent thermal stability and mechanical strength in the final product. Its low volatility and good solubility in epoxy formulations make it suitable for precision applications in the electronics and automotive industries. Also utilized in some dental composites and industrial laminates due to its reliable reactivity and shelf life when properly formulated.