Used as a curing agent for epoxy resins, enhancing mechanical strength and thermal stability in coatings, adhesives, and electronic encapsulants. Its reactivity allows for controlled cure at moderate temperatures, making it suitable in composite materials and electrical insulation applications. Also employed in the synthesis of pharmaceuticals and agrochemicals due to its heterocyclic structure, which serves as a building block in active molecules. Shows utility in catalyst systems and ligand design in coordination chemistry.