Gold
10 nm diameter, λmax, 780 nm, dispersion in H2O
Reagent
Code: #190072
CAS Number
7440-57-5
blur_circular Chemical Specifications
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Molecular Information
Weight
196.97 g/mol
Formula
Au
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Registry Numbers
EC Number
231-165-9
MDL Number
MFCD00003436
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Physical Properties
Melting Point
1063 °C(lit.)
Boiling Point
2808 °C(lit.)
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Storage & Handling
Storage
2-8℃
description Product Description
Used in electronics for reliable conductive connections in circuits and connectors due to excellent conductivity and resistance to corrosion. Common in aerospace and high-end devices where performance and reliability are critical.
Widely applied in dentistry for crowns, bridges, and fillings because of biocompatibility and resistance to tarnish.
Essential in jewelry and decorative items for its lustrous appearance and resistance to oxidation.
Used in medicine, particularly in treatments for rheumatoid arthritis through gold salts.
Applied in nanotechnology, where gold nanoparticles are used in sensors, imaging, and targeted drug delivery systems.
Used as a catalyst in chemical reactions, especially in oxidation processes and environmental applications like carbon monoxide detection.
Popular in investment and financial markets as bullion and coins due to its value and stability.
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