Used as a reactive diluent and crosslinking agent in epoxy resin systems, enhancing thermal stability and mechanical strength. Commonly applied in high-performance coatings, adhesives, and composite materials where improved heat resistance and durability are required. Its trifunctional structure supports dense network formation, making it suitable for electronics encapsulation and aerospace applications. Also utilized in specialty resins for 3D printing and UV-curable formulations due to its ability to modify viscosity without sacrificing reactivity.