Used as a reactive diluent in epoxy resin systems to reduce viscosity and improve workability without sacrificing performance. Enhances flexibility and impact resistance of cured epoxy formulations. Commonly applied in coatings, adhesives, sealants, and elastomers where toughness and low stress are required. Its hydrophobic nature improves moisture resistance, making it suitable for protective coatings in harsh environments. Also used in composite materials and electronic encapsulants due to its good electrical insulation properties and compatibility with various curing agents.