4,4'-Dihydroxytetraphenylmethane

≥98.0%(GC)

Reagent Code: #77197
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CAS Number 1844-01-5

science Other reagents with same CAS 1844-01-5

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 352.43 g/mol
Formula C₂₅H₂₀O₂
badge Registry Numbers
MDL Number MFCD00045785
inventory_2 Storage & Handling
Storage room temperature

description Product Description

Used primarily as a key intermediate in the synthesis of advanced polymers and resins, it contributes to the production of high-performance materials with excellent thermal stability and mechanical strength. In the electronics industry, it is utilized in the manufacture of epoxy resins, which are essential for encapsulating and protecting semiconductor devices. Additionally, it finds application in the development of adhesives and coatings, offering enhanced durability and resistance to environmental factors. Its role in creating flame-retardant materials is also noteworthy, making it valuable in safety-critical applications.

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Test Parameter Specification
Appearance White to Off-White solid
Purity 98
Proton NMR Spectrum Conforms to Structure

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Size Availability Unit Price Quantity
inventory 1g
10-20 days ฿1,580.00
inventory 5g
10-20 days ฿6,020.00

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4,4'-Dihydroxytetraphenylmethane
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Used primarily as a key intermediate in the synthesis of advanced polymers and resins, it contributes to the production of high-performance materials with excellent thermal stability and mechanical strength. In the electronics industry, it is utilized in the manufacture of epoxy resins, which are essential for encapsulating and protecting semiconductor devices. Additionally, it finds application in the development of adhesives and coatings, offering enhanced durability and resistance to environmental fac

Used primarily as a key intermediate in the synthesis of advanced polymers and resins, it contributes to the production of high-performance materials with excellent thermal stability and mechanical strength. In the electronics industry, it is utilized in the manufacture of epoxy resins, which are essential for encapsulating and protecting semiconductor devices. Additionally, it finds application in the development of adhesives and coatings, offering enhanced durability and resistance to environmental factors. Its role in creating flame-retardant materials is also noteworthy, making it valuable in safety-critical applications.

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