Used as a reactive diluent and crosslinking agent in epoxy resin systems. It improves the mechanical strength, thermal stability, and chemical resistance of cured epoxy formulations. Commonly applied in high-performance coatings, adhesives, and composite materials, especially in aerospace, electronics, and automotive industries. Its structure allows for enhanced flexibility and toughness without significantly reducing glass transition temperature. Also utilized in the synthesis of specialty polymers where controlled crosslinking and improved adhesion are required.