Used in advanced semiconductor manufacturing processes as a high-performance etching agent, particularly effective in the precise patterning of silicon-based materials. Its unique molecular structure allows for selective removal of layers with minimal damage to underlying substrates, making it ideal for fabricating nanoscale electronic components. Also employed in the development of next-generation microelectromechanical systems (MEMS) due to its stability under extreme process conditions. Shows promise in photovoltaic cell production by enhancing surface texturing for improved light absorption.