3a,4,7,7a-Tetrahydro-4,7-epoxyisobenzofuran-1,3-dione

95%

Reagent Code: #242479
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CAS Number 5426-09-5

science Other reagents with same CAS 5426-09-5

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 166.13 g/mol
Formula C₈H₆O₄
badge Registry Numbers
MDL Number MFCD00077442
thermostat Physical Properties
Boiling Point 372 °C at 760 mmHg (lit.)
inventory_2 Storage & Handling
Storage 2-8°C, inert gas

description Product Description

Used primarily as a reactive intermediate in the synthesis of high-performance polymers and resins. It is especially valuable in the production of epoxy resins due to its ability to form cross-linked networks with excellent thermal stability, mechanical strength, and electrical insulation properties. Commonly employed in composite materials for aerospace, electronics, and electrical encapsulation. Also utilized in coatings and adhesives requiring high durability and resistance to heat and chemicals. Its rigid cyclic structure contributes to improved glass transition temperatures in cured systems, making it suitable for advanced engineering applications.

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 250mg
10-20 days ฿180.00
inventory 1g
10-20 days ฿760.00
inventory 5g
10-20 days ฿1,400.00
inventory 25g
10-20 days ฿4,350.00
inventory 100g
10-20 days ฿15,190.00

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3a,4,7,7a-Tetrahydro-4,7-epoxyisobenzofuran-1,3-dione
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Used primarily as a reactive intermediate in the synthesis of high-performance polymers and resins. It is especially valuable in the production of epoxy resins due to its ability to form cross-linked networks with excellent thermal stability, mechanical strength, and electrical insulation properties. Commonly employed in composite materials for aerospace, electronics, and electrical encapsulation. Also utilized in coatings and adhesives requiring high durability and resistance to heat and chemicals. Its rigid cyclic structure contributes to improved glass transition temperatures in cured systems, making it suitable for advanced engineering applications.
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